74HCT1G66GW,165
vs
74HCT1G66GW-T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NEXPERIA
Part Package Code
TSSOP
Package Description
1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5
,
Pin Count
5
Manufacturer Package Code
SOT353-1
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPST
SPST
JESD-30 Code
R-PDSO-G5
JESD-609 Code
e3
Length
2 mm
Moisture Sensitivity Level
1
Normal Position
NO
Number of Channels
1
Number of Functions
1
Number of Terminals
5
Off-state Isolation-Nom
50 dB
On-state Resistance-Max (Ron)
142 Ω
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Code
TSSOP
Package Equivalence Code
TSSOP5/6,.08
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
Switch-off Time-Max
53 ns
Switch-on Time-Max
36 ns
Switching
MAKE-BEFORE-BREAK
Technology
CMOS
Temperature Grade
AUTOMOTIVE
Terminal Finish
Tin (Sn)
Terminal Form
GULL WING
Terminal Pitch
0.65 mm
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
1.25 mm
Base Number Matches
2
2
Date Of Intro
2017-02-01
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