74HCT1G66GW,125 vs 74H1G66S feature comparison

74HCT1G66GW,125 NXP Semiconductors

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74H1G66S STMicroelectronics

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS STMICROELECTRONICS
Part Package Code TSSOP SOT-23
Package Description 1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5 LSSOP, TSOP5/6,.11,37
Pin Count 5 5
Manufacturer Package Code SOT353-1
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPST SPST
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3 e0
Length 2 mm 2.9 mm
Moisture Sensitivity Level 1
Normal Position NO NO
Number of Channels 1 1
Number of Functions 1 1
Number of Terminals 5 5
Off-state Isolation-Nom 50 dB 60 dB
On-state Resistance-Max (Ron) 142 Ω 170 Ω
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP LSSOP
Package Equivalence Code TSSOP5/6,.08 TSOP5/6,.11,37
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.45 mm
Supply Voltage-Max (Vsup) 5.5 V 12 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Switch-off Time-Max 53 ns 20 ns
Switch-on Time-Max 36 ns 23 ns
Switching MAKE-BEFORE-BREAK
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Tin (Sn) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.95 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1.25 mm 1.625 mm
Base Number Matches 1 2
Pbfree Code No
On-state Resistance Match-Nom 10 Ω

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