74HCT112DB
vs
HD74LS76ARP-EL
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
HITACHI LTD
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
SSOP, SSOP16,.3
|
SOP,
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
HCT
|
LS
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
JESD-609 Code |
e4
|
|
Length |
6.2 mm
|
9.9 mm
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
J-K FLIP-FLOP
|
J-K FLIP-FLOP
|
Max Frequency@Nom-Sup |
20000000 Hz
|
|
Max I(ol) |
0.004 A
|
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
2
|
2
|
Number of Functions |
2
|
2
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
75 °C
|
Operating Temperature-Min |
-40 °C
|
-20 °C
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SSOP
|
SOP
|
Package Equivalence Code |
SSOP16,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Propagation Delay (tpd) |
60 ns
|
20 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2 mm
|
1.75 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
4.5 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
TTL
|
Temperature Grade |
AUTOMOTIVE
|
COMMERCIAL EXTENDED
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Trigger Type |
NEGATIVE EDGE
|
NEGATIVE EDGE
|
Width |
5.3 mm
|
3.95 mm
|
fmax-Min |
20 MHz
|
30 MHz
|
Base Number Matches |
4
|
1
|
|
|
|
Compare 74HCT112DB with alternatives
Compare HD74LS76ARP-EL with alternatives