74HCT10DB vs 74LV00PW,112 feature comparison

74HCT10DB Nexperia

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74LV00PW,112 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Package Description SSOP-14 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2017-02-01
Family HCT LV/LV-A/LVX/H
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e4
Length 6.2 mm 5 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1 1
Number of Functions 3 4
Number of Inputs 3 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 36 ns 31 ns
Seated Height-Max 2 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 1 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 5.3 mm 4.4 mm
Base Number Matches 2 2
Part Package Code TSSOP
Pin Count 14
Manufacturer Package Code SOT402-1
Factory Lead Time 4 Weeks
Load Capacitance (CL) 50 pF
Max I(ol) 0.006 A
Package Equivalence Code TSSOP14,.25
Packing Method TUBE
Prop. Delay@Nom-Sup 18 ns
Qualification Status Not Qualified
Schmitt Trigger NO

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