74LV00PW,112 vs 74LV00PW,698 feature comparison

74LV00PW,112 NXP Semiconductors

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74LV00PW,698 Nexperia

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Rohs Code Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code TSSOP TSSOP
Package Description 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14
Pin Count 14 14
Manufacturer Package Code SOT402-1 SOT402-1
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Family LV/LV-A/LVX/H
JESD-30 Code R-PDSO-G14
JESD-609 Code e4
Length 5 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE
Max I(ol) 0.006 A
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Number of Terminals 14
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TSSOP
Package Equivalence Code TSSOP14,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 18 ns
Propagation Delay (tpd) 31 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 1 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm
Base Number Matches 2 2
Samacsys Manufacturer Nexperia

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