74LV00PW,112
vs
74LV00PW,698
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
|
| Part Package Code |
TSSOP
|
TSSOP
|
| Package Description |
4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14
|
4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14
|
| Pin Count |
14
|
14
|
| Manufacturer Package Code |
SOT402-1
|
SOT402-1
|
| Reach Compliance Code |
compliant
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
4 Weeks
|
|
| Family |
LV/LV-A/LVX/H
|
|
| JESD-30 Code |
R-PDSO-G14
|
|
| JESD-609 Code |
e4
|
|
| Length |
5 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
NAND GATE
|
|
| Max I(ol) |
0.006 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
4
|
|
| Number of Inputs |
2
|
|
| Number of Terminals |
14
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSSOP
|
|
| Package Equivalence Code |
TSSOP14,.25
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
| Packing Method |
TUBE
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Prop. Delay@Nom-Sup |
18 ns
|
|
| Propagation Delay (tpd) |
31 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Schmitt Trigger |
NO
|
|
| Seated Height-Max |
1.1 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
1 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
4.4 mm
|
|
| Base Number Matches |
2
|
2
|
| Samacsys Manufacturer |
|
Nexperia
|
|
|
|
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