74LV00PW,112
vs
74LV00PW,698
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
Part Package Code
TSSOP
TSSOP
Package Description
4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14
4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14
Pin Count
14
14
Manufacturer Package Code
SOT402-1
SOT402-1
Reach Compliance Code
compliant
HTS Code
8542.39.00.01
Factory Lead Time
4 Weeks
Family
LV/LV-A/LVX/H
JESD-30 Code
R-PDSO-G14
JESD-609 Code
e4
Length
5 mm
Load Capacitance (CL)
50 pF
Logic IC Type
NAND GATE
Max I(ol)
0.006 A
Moisture Sensitivity Level
1
Number of Functions
4
Number of Inputs
2
Number of Terminals
14
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Code
TSSOP
Package Equivalence Code
TSSOP14,.25
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TUBE
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
18 ns
Propagation Delay (tpd)
31 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
1 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
Terminal Pitch
0.65 mm
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
4.4 mm
Base Number Matches
2
2
Samacsys Manufacturer
Nexperia
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