74HC597DB,112 vs MC74HC597AD feature comparison

74HC597DB,112 NXP Semiconductors

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MC74HC597AD Motorola Semiconductor Products

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code SSOP1
Pin Count 16
Manufacturer Package Code SOT338-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Count Direction RIGHT RIGHT
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e0
Length 6.2 mm 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type PARALLEL IN SERIAL OUT PARALLEL IN SERIAL OUT
Max Frequency@Nom-Sup 20000000 Hz
Moisture Sensitivity Level 1
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Equivalence Code SSOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 53 ns 240 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.3 mm 3.9 mm
fmax-Min 20 MHz 25 MHz
Base Number Matches 2 5
Package Description 0.150 INCH, PLASTIC, SOIC-16

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