74HC4066DB,118 vs CD54HC4066F3A feature comparison

74HC4066DB,118 NXP Semiconductors

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CD54HC4066F3A Intersil Corporation

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS HARRIS SEMICONDUCTOR
Part Package Code SSOP1
Package Description 5.30 MM, PLASTIC, SOT-337-1, MO-150, SSOP-14 DIP, DIP14,.3
Pin Count 14
Manufacturer Package Code SOT337-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Analog IC - Other Type SPST SPST
JESD-30 Code R-PDSO-G14 R-GDIP-T14
JESD-609 Code e4 e0
Length 6.2 mm
Moisture Sensitivity Level 1
Normal Position NO NO
Number of Channels 1 1
Number of Functions 4 4
Number of Terminals 14 14
Off-state Isolation-Nom 50 dB
On-state Resistance Match-Nom 5 Ω
On-state Resistance-Max (Ron) 142 Ω 142 Ω
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output SEPARATE OUTPUT SEPARATE OUTPUT
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SSOP DIP
Package Equivalence Code SSOP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm
Supply Voltage-Max (Vsup) 10 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V 6 V
Surface Mount YES NO
Switch-off Time-Max 45 ns
Switch-on Time-Max 30 ns 20 ns
Switching MAKE-BEFORE-BREAK MAKE-BEFORE-BREAK
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm
Base Number Matches 2 3
Supply Current-Max (Isup) 0.16 mA

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