74HC4066D vs TC74HC4066AFN(TP1) feature comparison

74HC4066D NXP Semiconductors

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TC74HC4066AFN(TP1) Toshiba America Electronic Components

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description 3.90 MM, PLASTIC, SOT-108-1, MS-012, SO-14 SOP,
Pin Count 14 14
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPST SPST
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4
Length 8.65 mm 8.65 mm
Moisture Sensitivity Level 1
Normal Position NO
Number of Channels 1 1
Number of Functions 4 4
Number of Terminals 14 14
Off-state Isolation-Nom 50 dB 60 dB
On-state Resistance Match-Nom 5 Ω 5 Ω
On-state Resistance-Max (Ron) 142 Ω 80 Ω
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output SEPARATE OUTPUT
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 10 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V 12 V
Surface Mount YES YES
Switch-off Time-Max 45 ns 18 ns
Switch-on Time-Max 30 ns 12 ns
Switching MAKE-BEFORE-BREAK
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 3.9 mm 3.9 mm
Base Number Matches 12 2
Neg Supply Voltage-Nom (Vsup)
Supply Current-Max (Isup) 0.08 mA

Compare 74HC4066D with alternatives

Compare TC74HC4066AFN(TP1) with alternatives