74HC4050N,652 vs TC74HC4050AP feature comparison

74HC4050N,652 NXP Semiconductors

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TC74HC4050AP Toshiba America Electronic Components

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code DIP DIP
Package Description DIP-16 DIP, DIP16,.3
Pin Count 16 16
Manufacturer Package Code SOT38-4
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
Additional Feature CMOS-TTL LEVEL TRANSLATOR
Family HC/UH HC
JESD-30 Code R-PDIP-T16 R-PDIP-T16
JESD-609 Code e4
Length 21.6 mm 19.25 mm
Load Capacitance (CL) 50 pF 150 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.004 A 0.0078 A
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 26 ns 29 ns
Propagation Delay (tpd) 26 ns 145 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 4.7 mm 4.45 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 75 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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