TC74HC4050AP vs CD74HC4050E feature comparison

TC74HC4050AP Toshiba America Electronic Components

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CD74HC4050E General Electric Solid State

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Rohs Code Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP GENERAL ELECTRIC SOLID STATE
Part Package Code DIP
Package Description DIP, DIP16,.3
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC
JESD-30 Code R-PDIP-T16
Length 19.25 mm
Load Capacitance (CL) 150 pF
Logic IC Type BUFFER
Max I(ol) 0.0078 A
Number of Functions 6
Number of Inputs 1
Number of Terminals 16
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 75 mA
Prop. Delay@Nom-Sup 29 ns
Propagation Delay (tpd) 145 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 4.45 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm
Base Number Matches 1 7

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