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74HC3G04GD,125 vs 74HC2G00GD,125 feature comparison

74HC3G04GD,125 NXP Semiconductors

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74HC2G00GD,125 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SON SON
Package Description 3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, XSON-8 3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, XSON-8
Pin Count 8 8
Manufacturer Package Code SOT996-2 SOT996-2
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-N8 R-PDSO-N8
JESD-609 Code e4 e4
Length 3 mm 3 mm
Logic IC Type INVERTER NAND GATE
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1 1
Number of Functions 3 2
Number of Inputs 1 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON VSON
Package Equivalence Code SOLCC8,.12,20 SOLCC8,.11,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 110 ns 110 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 0.5 mm 0.5 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 2 mm 2 mm
Base Number Matches 2 2
Factory Lead Time 4 Weeks
Load Capacitance (CL) 50 pF
Prop. Delay@Nom-Sup 22 ns
Logic » Gates
Logic » Gates

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