74HC373BQ-Q100
vs
MC74HC373ADT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NEXPERIA
ON SEMICONDUCTOR
Package Description
HVQCCN,
TSSOP, TSSOP20,.25
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Date Of Intro
2017-02-01
Family
HC/UH
HC/UH
JESD-30 Code
R-PQCC-N20
R-PDSO-G20
JESD-609 Code
e4
e4
Length
4.5 mm
6.5 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Moisture Sensitivity Level
1
1
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
265 ns
210 ns
Screening Level
AEC-Q100
Seated Height-Max
1 mm
1.2 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Finish
NICKEL PALLADIUM GOLD SILVER
NICKEL PALLADIUM GOLD
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
2.5 mm
4.4 mm
Base Number Matches
2
5
Part Package Code
TSSOP
Pin Count
20
Load Capacitance (CL)
50 pF
Max I(ol)
0.006 A
Package Equivalence Code
TSSOP20,.25
Packing Method
RAIL
Prop. Delay@Nom-Sup
38 ns
Qualification Status
Not Qualified
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Compare MC74HC373ADT with alternatives