74HC373BQ-Q100
vs
MC74HC373ADTR2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description
2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20
TSSOP, TSSOP20,.25
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
HC/UH
JESD-30 Code
R-PQCC-N20
R-PDSO-G20
Length
4.5 mm
Logic IC Type
BUS DRIVER
D LATCH
Moisture Sensitivity Level
1
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
Number of Terminals
20
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
265 ns
Screening Level
AEC-Q100
Seated Height-Max
1 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.635 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
2.5 mm
Base Number Matches
2
4
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Max I(ol)
0.0024 A
Package Equivalence Code
TSSOP20,.25
Packing Method
TAPE AND REEL
Power Supplies
2/6 V
Prop. Delay@Nom-Sup
130 ns
Qualification Status
Not Qualified
Terminal Finish
Tin/Lead (Sn/Pb)