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74HC2G02DC,125 vs 74LVC3G34GM feature comparison

74HC2G02DC,125 NXP Semiconductors

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74LVC3G34GM NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SSOP QFN
Package Description 2.30 MM, PLASTIC, MO-187, SOT-765-1, VSSOP-8 1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, QFN-8
Pin Count 8 8
Manufacturer Package Code SOT765-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family HC/UH LVC/LCX/Z
JESD-30 Code R-PDSO-G8 S-PBCC-B8
JESD-609 Code e4
Length 2.3 mm 1.6 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NOR GATE BUFFER
Max I(ol) 0.004 A 0.024 A
Moisture Sensitivity Level 1 1
Number of Functions 2 3
Number of Inputs 2 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSSOP VBCC
Package Equivalence Code TSSOP8,.12,20 SOLCC8,.04,20
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH CHIP CARRIER, VERY THIN PROFILE
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 22 ns 5.1 ns
Propagation Delay (tpd) 110 ns 10.8 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1 mm 0.5 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 1.65 V
Supply Voltage-Nom (Vsup) 5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING BUTT
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 2 mm 1.6 mm
Base Number Matches 2 3
Logic » Gates
Logic » Gates

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