74HC2G00GD
vs
74V2T03CTR
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
STMICROELECTRONICS
|
Part Package Code |
SON
|
SC-70
|
Package Description |
VSON, SOLCC8,.11,20
|
SOT-323, 8 PIN
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
HC/UH
|
74V
|
JESD-30 Code |
R-PDSO-N8
|
R-PDSO-G8
|
JESD-609 Code |
e4
|
|
Length |
3 mm
|
2 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
NAND GATE
|
NAND GATE
|
Max I(ol) |
0.004 A
|
0.008 A
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
2
|
2
|
Number of Inputs |
2
|
2
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSON
|
TSSOP
|
Package Equivalence Code |
SOLCC8,.11,20
|
TSSOP8,.09,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Packing Method |
TR
|
TR
|
Peak Reflow Temperature (Cel) |
260
|
|
Prop. Delay@Nom-Sup |
22 ns
|
10 ns
|
Propagation Delay (tpd) |
110 ns
|
10 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Schmitt Trigger |
NO
|
NO
|
Seated Height-Max |
0.5 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
2 mm
|
1.25 mm
|
Base Number Matches |
2
|
1
|
Manufacturer Package Code |
|
SOT323
|
Output Characteristics |
|
OPEN-DRAIN
|
|
|
|
Compare 74HC2G00GD with alternatives
Compare 74V2T03CTR with alternatives