74HC2G00GD
vs
74LVC1G99GM
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NEXPERIA
Part Package Code
SON
Package Description
VSON, SOLCC8,.11,20
VQCCN,
Pin Count
8
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
LVC/LCX/Z
JESD-30 Code
R-PDSO-N8
S-PQCC-N8
JESD-609 Code
e4
e4
Length
3 mm
1.6 mm
Load Capacitance (CL)
50 pF
Logic IC Type
NAND GATE
MAJORITY LOGIC GATE
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
1
Number of Functions
2
1
Number of Inputs
2
4
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSON
VQCCN
Package Equivalence Code
SOLCC8,.11,20
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, VERY THIN PROFILE
CHIP CARRIER, VERY THIN PROFILE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
22 ns
Propagation Delay (tpd)
110 ns
38.5 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
0.5 mm
0.5 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
1.65 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
NICKEL PALLADIUM GOLD
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
2 mm
1.6 mm
Base Number Matches
2
2
Output Characteristics
3-STATE
Compare 74HC2G00GD with alternatives
Compare 74LVC1G99GM with alternatives