74HC2G00GD
vs
74LVC3G34GM
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Not Recommended
|
Ihs Manufacturer |
NEXPERIA
|
NEXPERIA
|
Package Description |
VSON,
|
VBCC,
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Date Of Intro |
2017-02-01
|
|
Family |
HC/UH
|
LVC/LCX/Z
|
JESD-30 Code |
R-PDSO-N8
|
S-PBCC-B8
|
JESD-609 Code |
e4
|
e4
|
Length |
3 mm
|
1.6 mm
|
Logic IC Type |
NAND GATE
|
BUFFER
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
2
|
3
|
Number of Inputs |
2
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSON
|
VBCC
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
CHIP CARRIER, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Propagation Delay (tpd) |
110 ns
|
10.8 ns
|
Seated Height-Max |
0.5 mm
|
0.5 mm
|
Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2 V
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
NO LEAD
|
BUTT
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
2 mm
|
1.6 mm
|
Base Number Matches |
2
|
3
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare 74HC2G00GD with alternatives
Compare 74LVC3G34GM with alternatives