74HC257DB,112 vs SN54LS353FK feature comparison

74HC257DB,112 NXP Semiconductors

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SN54LS353FK Rochester Electronics LLC

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Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code SSOP1
Package Description 5.30 MM, PLASTIC, MO-150, SOT-338-1, SSOP-16 QCCN,
Pin Count 16
Manufacturer Package Code SOT338-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH LS
JESD-30 Code R-PDSO-G16 S-CQCC-N20
JESD-609 Code e4 e0
Length 6.2 mm 8.89 mm
Load Capacitance (CL) 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.006 A
Moisture Sensitivity Level 1
Number of Functions 4 2
Number of Inputs 2 4
Number of Outputs 1 1
Number of Terminals 16 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE INVERTED
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code SSOP QCCN
Package Equivalence Code SSOP16,.3
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, SHRINK PITCH CHIP CARRIER
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 33 ns
Propagation Delay (tpd) 165 ns 32 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 2.03 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS TTL
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm 8.89 mm
Base Number Matches 2 2
Pbfree Code No

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