74HC257DB,112
vs
SN74LS354FNR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
TEXAS INSTRUMENTS INC
Part Package Code
SSOP1
Package Description
5.30 MM, PLASTIC, MO-150, SOT-338-1, SSOP-16
QCCJ,
Pin Count
16
Manufacturer Package Code
SOT338-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
LS
JESD-30 Code
R-PDSO-G16
S-PQCC-J20
JESD-609 Code
e4
Length
6.2 mm
8.9662 mm
Load Capacitance (CL)
50 pF
45 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.006 A
Moisture Sensitivity Level
1
Number of Functions
4
1
Number of Inputs
2
8
Number of Outputs
1
1
Number of Terminals
16
20
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
QCCJ
Package Equivalence Code
SSOP16,.3
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, SHRINK PITCH
CHIP CARRIER
Packing Method
TUBE
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
33 ns
Propagation Delay (tpd)
165 ns
45 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
4.57 mm
Supply Voltage-Max (Vsup)
6 V
5.25 V
Supply Voltage-Min (Vsup)
2 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
TTL
Temperature Grade
AUTOMOTIVE
COMMERCIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
J BEND
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
5.3 mm
8.9662 mm
Base Number Matches
2
1
Additional Feature
TRANSPARENT ADDRESS LATCHES
Power Supply Current-Max (ICC)
46 mA
Compare 74HC257DB,112 with alternatives
Compare SN74LS354FNR with alternatives