74HC237N
vs
SN74HC4514DW
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
TEXAS INSTRUMENTS INC
Part Package Code
DIP
SOIC
Package Description
0.300 INCH, PLASTIC, SOT-38-4, DIP-16
SOP, SOP24,.4
Pin Count
16
24
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
NXP
Additional Feature
ADDRESS LATCHES
Family
HC/UH
HC/UH
Input Conditioning
LATCHED
LATCHED
JESD-30 Code
R-PDIP-T16
R-PDSO-G24
JESD-609 Code
e4
Length
19.025 mm
15.4 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
3-LINE TO 8-LINE DECODER
4-LINE TO 16-LINE DECODER
Max I(ol)
0.004 A
0.0052 A
Number of Functions
1
1
Number of Terminals
16
24
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP16,.3
SOP24,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Prop. Delay@Nom-Sup
48 ns
58 ns
Propagation Delay (tpd)
240 ns
290 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.2 mm
2.65 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.5 mm
Base Number Matches
3
5
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare 74HC237N with alternatives
Compare SN74HC4514DW with alternatives