74HC237N
vs
5962-8860601EA
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
DEFENSE LOGISTICS AGENCY
Package Description
DIP-16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
JESD-30 Code
R-PDIP-T16
R-GDIP-T16
JESD-609 Code
e4
e0
Load Capacitance (CL)
50 pF
Logic IC Type
OTHER DECODER/DRIVER
3-LINE TO 8-LINE DECODER
Max I(ol)
0.004 A
Number of Functions
1
1
Number of Terminals
16
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
48 ns
Qualification Status
Not Qualified
Qualified
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
5
Additional Feature
2 ENABLE INPUTS
Family
HCT
Input Conditioning
LATCHED
Output Polarity
TRUE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
355 ns
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
4.5 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
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