74HC237N,652
vs
CD74HC137EX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
HARRIS SEMICONDUCTOR
Part Package Code
DIP
Package Description
DIP, DIP16,.3
DIP, DIP16,.3
Pin Count
16
Manufacturer Package Code
SOT38-4
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
ADDRESS LATCHES
ADDRESS LATCHES
Family
HC/UH
HC/UH
Input Conditioning
LATCHED
LATCHED
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
JESD-609 Code
e4
e0
Length
19.025 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
3-LINE TO 8-LINE DECODER
3-LINE TO 8-LINE DECODER
Max I(ol)
0.004 A
0.004 A
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
TRUE
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
48 ns
54 ns
Propagation Delay (tpd)
240 ns
270 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.2 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Finish
NICKEL PALLADIUM GOLD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
2
ECCN Code
EAR99
Compare 74HC237N,652 with alternatives
Compare CD74HC137EX with alternatives