CD74HC137EX
vs
M54HC137F1R
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
STMICROELECTRONICS
Package Description
DIP, DIP16,.3
DIP, DIP16,.3
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
ADDRESS LATCHES
ADDRESS LATCHES; 2 ENABLE INPUTS
Family
HC/UH
HC/UH
Input Conditioning
LATCHED
LATCHED
JESD-30 Code
R-PDIP-T16
R-GDIP-T16
JESD-609 Code
e0
e0
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
3-LINE TO 8-LINE DECODER
3-LINE TO 8-LINE DECODER
Max I(ol)
0.004 A
0.004 A
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
54 ns
41 ns
Propagation Delay (tpd)
270 ns
110 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
4.5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
1
Pbfree Code
No
Part Package Code
DIP
Pin Count
16
Seated Height-Max
5.08 mm
Width
7.62 mm
Compare CD74HC137EX with alternatives
Compare M54HC137F1R with alternatives