74HC237N,652
vs
TC74VHC238FS
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TOSHIBA CORP
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP, DIP16,.3
|
LSSOP, SSOP16,.25
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
SOT38-4
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ADDRESS LATCHES
|
|
| Family |
HC/UH
|
AHC/VHC
|
| Input Conditioning |
LATCHED
|
STANDARD
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
|
| Length |
19.025 mm
|
5 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
3-LINE TO 8-LINE DECODER
|
3-LINE TO 8-LINE DECODER
|
| Max I(ol) |
0.004 A
|
0.008 A
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
LSSOP
|
| Package Equivalence Code |
DIP16,.3
|
SSOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Prop. Delay@Nom-Sup |
48 ns
|
11.5 ns
|
| Propagation Delay (tpd) |
240 ns
|
18 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.2 mm
|
1.6 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
4.4 mm
|
| Base Number Matches |
1
|
2
|
| ECCN Code |
|
EAR99
|
|
|
|
Compare 74HC237N,652 with alternatives
Compare TC74VHC238FS with alternatives