74HC165D,653
vs
GD54HC165D
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
GOLDSTAR ELECTRON CO LTD
|
| Part Package Code |
SOP
|
|
| Package Description |
3.90 MM, PLASTIC, MS-012, SOT-109-1, SOP-16
|
,
|
| Pin Count |
16
|
|
| Manufacturer Package Code |
SOT109-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Additional Feature |
CLOCK INHIBIT
|
|
| Count Direction |
RIGHT
|
|
| Family |
HC/UH
|
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
|
| Length |
9.9 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
PARALLEL IN SERIAL OUT
|
PARALLEL IN SERIAL OUT
|
| Max Frequency@Nom-Sup |
24000000 Hz
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
8
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Polarity |
COMPLEMENTARY
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
|
| Package Equivalence Code |
SOP16,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
250 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Voltage-Max (Vsup) |
6 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Trigger Type |
POSITIVE EDGE
|
|
| Width |
3.9 mm
|
|
| fmax-Min |
24 MHz
|
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare 74HC165D,653 with alternatives
Compare GD54HC165D with alternatives