74HC112D,652
vs
HD74HC375FP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
HITACHI LTD
Part Package Code
SOP
SOIC
Package Description
PLASTIC, SOT-108, SO-14
SOP, SOP16,.3
Pin Count
16
16
Manufacturer Package Code
SOT109-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e4
Length
9.9 mm
10.06 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
J-K FLIP-FLOP
D LATCH
Max Frequency@Nom-Sup
20000000 Hz
Max I(ol)
0.004 A
0.004 A
Moisture Sensitivity Level
1
1
Number of Bits
2
2
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP16,.25
SOP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
265 ns
200 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
2.2 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
4.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
20
Trigger Type
NEGATIVE EDGE
HIGH LEVEL
Width
3.9 mm
5.5 mm
fmax-Min
24 MHz
Base Number Matches
1
2
Prop. Delay@Nom-Sup
36 ns
Compare 74HC112D,652 with alternatives
Compare HD74HC375FP with alternatives