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74HC03D,653 vs 74HC03D/G feature comparison

74HC03D,653 NXP Semiconductors

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74HC03D/G

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Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code SOIC
Package Description SOT-108-1, SO-14
Pin Count 14
Manufacturer Package Code SOT108-1
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Family HC/UH
JESD-30 Code R-PDSO-G14
JESD-609 Code e4
Length 8.65 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Number of Terminals 14
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 29 ns
Propagation Delay (tpd) 29 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm
Base Number Matches 2
Logic ยป Gates

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