74HC03D,653
vs
74HCT03D-Q100J
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SOIC
SOIC
Package Description
SOT-108-1, SO-14
3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
Pin Count
14
14
Manufacturer Package Code
SOT108-1
SOT108-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
Factory Lead Time
4 Weeks
Family
HC/UH
HCT
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e4
Length
8.65 mm
8.65 mm
Load Capacitance (CL)
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
OPEN-DRAIN
OPEN-DRAIN
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
29 ns
Propagation Delay (tpd)
29 ns
36 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
3.9 mm
Base Number Matches
2
2
Screening Level
AEC-Q100
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