74F673ASPCQR
vs
54HHSC166FL
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
GEC PLESSEY SEMICONDUCTORS
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP24,.3
|
,
|
| Pin Count |
24
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
PARALLEL OUTPUT IS REGISTERED; READ/WRITE CONTROL; COMMON SERIAL I/O PIN
|
CLOCK INHIBIT; RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHNOLOGY
|
| Count Direction |
RIGHT
|
RIGHT
|
| Family |
F/FAST
|
HSC
|
| JESD-30 Code |
R-PDIP-T24
|
R-CDFP-F16
|
| JESD-609 Code |
e0
|
|
| Length |
30.095 mm
|
|
| Logic IC Type |
SERIAL IN PARALLEL OUT
|
PARALLEL IN SERIAL OUT
|
| Number of Bits |
16
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
16
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DFP
|
| Package Equivalence Code |
DIP24,.3
|
FL16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Propagation Delay (tpd) |
12 ns
|
28 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
TTL
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
FLAT
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
NEGATIVE EDGE
|
POSITIVE EDGE
|
| Width |
7.62 mm
|
|
| fmax-Min |
130 MHz
|
|
| Base Number Matches |
1
|
1
|
| Load Capacitance (CL) |
|
50 pF
|
|
|
|
Compare 74F673ASPCQR with alternatives
Compare 54HHSC166FL with alternatives