74F30PC
vs
N74F30N,602
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FAIRCHILD SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Part Package Code
DIP
DIP
Package Description
0.300 INCH, PLASTIC, MS-001, DIP-14
0.300 INCH, PLASTIC, DIP-14
Pin Count
14
14
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
F/FAST
F/FAST
JESD-30 Code
R-PDIP-T14
R-PDIP-T14
Length
19.18 mm
19.025 mm
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.02 A
0.02 A
Number of Functions
1
1
Number of Inputs
8
8
Number of Terminals
14
14
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supply Current-Max (ICC)
4.5 mA
4 mA
Prop. Delay@Nom-Sup
5.5 ns
5.5 ns
Propagation Delay (tpd)
5.5 ns
5.5 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
5.08 mm
4.2 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
7.62 mm
Base Number Matches
2
1
Manufacturer Package Code
SOT27-1
JESD-609 Code
e4
Load Capacitance (CL)
50 pF
Packing Method
TUBE
Terminal Finish
NICKEL PALLADIUM GOLD
Compare 74F30PC with alternatives
Compare N74F30N,602 with alternatives