74F30PC
vs
54F30DM
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP14,.3
Pin Count
14
14
Reach Compliance Code
unknown
unknown
Family
F/FAST
F/FAST
JESD-30 Code
R-PDIP-T14
R-GDIP-T14
Length
19.18 mm
19.43 mm
Logic IC Type
NAND GATE
NAND GATE
Moisture Sensitivity Level
NOT SPECIFIED
Number of Functions
1
1
Number of Inputs
8
8
Number of Terminals
14
14
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
5.5 ns
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
NOT SPECIFIED
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
7.62 mm
Base Number Matches
4
1
HTS Code
8542.39.00.01
Max I(ol)
0.02 A
Package Equivalence Code
DIP14,.3
Power Supply Current-Max (ICC)
4.5 mA
Schmitt Trigger
NO
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