74CBTLV3384PGG vs 74CBTLV3384PW feature comparison

74CBTLV3384PGG Integrated Device Technology Inc

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74CBTLV3384PW NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC NXP SEMICONDUCTORS
Part Package Code TSSOP TSSOP
Package Description GREEN, TSSOP-24 4.40 MM, PLASTIC, MO-153, SOT355-1, TSSOP-24
Pin Count 24 24
Manufacturer Package Code PGG24
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family CBTLV/3B CBTLV/3B
JESD-30 Code R-PDSO-G24 R-PDSO-G24
JESD-609 Code e3 e4
Length 7.8 mm 7.8 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1 1
Number of Bits 5 10
Number of Functions 2 1
Number of Ports 2 2
Number of Terminals 24 24
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP24,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Propagation Delay (tpd) 0.25 ns 0.31 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish MATTE TIN Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 4.4 mm 4.4 mm
Base Number Matches 2 2

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