74CBTLV3384PW vs IDT74CBTLV3384PG feature comparison

74CBTLV3384PW NXP Semiconductors

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IDT74CBTLV3384PG Integrated Device Technology Inc

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TSSOP TSSOP
Package Description 4.40 MM, PLASTIC, MO-153, SOT355-1, TSSOP-24 TSSOP, TSSOP24,.25
Pin Count 24 24
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family CBTLV/3B CBTLV/3B
JESD-30 Code R-PDSO-G24 R-PDSO-G24
JESD-609 Code e4 e0
Length 7.8 mm 7.8 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1 1
Number of Bits 10 5
Number of Functions 1 2
Number of Ports 2 2
Number of Terminals 24 24
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 240
Propagation Delay (tpd) 0.31 ns 0.25 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 20
Width 4.4 mm 4.4 mm
Base Number Matches 2 1
Output Characteristics 3-STATE
Package Equivalence Code TSSOP24,.25
Supply Voltage-Nom (Vsup) 2.5 V

Compare 74CBTLV3384PW with alternatives

Compare IDT74CBTLV3384PG with alternatives