74CBTLV3384PW
vs
IDT74CBTLV3384PG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
TSSOP
TSSOP
Package Description
4.40 MM, PLASTIC, MO-153, SOT355-1, TSSOP-24
TSSOP, TSSOP24,.25
Pin Count
24
24
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
CBTLV/3B
CBTLV/3B
JESD-30 Code
R-PDSO-G24
R-PDSO-G24
JESD-609 Code
e4
e0
Length
7.8 mm
7.8 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Moisture Sensitivity Level
1
1
Number of Bits
10
5
Number of Functions
1
2
Number of Ports
2
2
Number of Terminals
24
24
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
240
Propagation Delay (tpd)
0.31 ns
0.25 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
20
Width
4.4 mm
4.4 mm
Base Number Matches
2
1
Output Characteristics
3-STATE
Package Equivalence Code
TSSOP24,.25
Supply Voltage-Nom (Vsup)
2.5 V
Compare 74CBTLV3384PW with alternatives
Compare IDT74CBTLV3384PG with alternatives