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74AUP3G04GM,125 vs 74AHCT2G00DC,125 feature comparison

74AUP3G04GM,125 Nexperia

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74AHCT2G00DC,125 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Part Package Code QFN SSOP
Package Description 1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, QFN-8 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8
Pin Count 8 8
Manufacturer Package Code SOT902-2 SOT765-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Nexperia
Family AUP/ULP/V AHCT/VHCT/VT
JESD-30 Code S-PQCC-N8 R-PDSO-G8
JESD-609 Code e4 e4
Length 1.6 mm 2.3 mm
Logic IC Type INVERTER NAND GATE
Moisture Sensitivity Level 1 1
Number of Functions 3 2
Number of Inputs 1 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VQCCN VSSOP
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 20.9 ns 10 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 1 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 0.8 V 4.5 V
Supply Voltage-Nom (Vsup) 1.2 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.6 mm 2 mm
Base Number Matches 2 2
Factory Lead Time 4 Weeks
Load Capacitance (CL) 50 pF
Max I(ol) 0.008 A
Output Characteristics 3-STATE
Package Equivalence Code TSSOP8,.12,20
Packing Method TR
Prop. Delay@Nom-Sup 10 ns
Schmitt Trigger NO
Logic » Gates
Logic » Gates

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