74AUP2G241GT
vs
74AUP2G241GS
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NEXPERIA
Part Package Code
SON
Package Description
1 X 1.95 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT833-1, SON-8
VSON,
Pin Count
8
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Control Type
ENABLE LOW/HIGH
Family
AUP/ULP/V
AUP/ULP/V
JESD-30 Code
R-PDSO-N8
R-PDSO-N8
JESD-609 Code
e3
e3
Length
1.95 mm
1.35 mm
Load Capacitance (CL)
30 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.0017 A
Moisture Sensitivity Level
1
1
Number of Bits
1
1
Number of Functions
2
2
Number of Ports
2
2
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSON
VSON
Package Equivalence Code
SOLCC8,.04,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE
SMALL OUTLINE, VERY THIN PROFILE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
24 ns
Propagation Delay (tpd)
24 ns
24 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.5 mm
0.35 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
0.8 V
0.8 V
Supply Voltage-Nom (Vsup)
1.1 V
1.1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin (Sn)
TIN
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.35 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
1 mm
1 mm
Base Number Matches
2
2
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