74AUP2G241GS
vs
SN74AUP2G125YFPR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
TEXAS INSTRUMENTS INC
Part Package Code
SON
BGA
Package Description
1 X 1.35 MM, 0.35 MM HEIGHT, SOT-1203, SON-8
GREEN, BGA-8
Pin Count
8
8
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
AUP/ULP/V
AUP/ULP/V
JESD-30 Code
R-PDSO-N8
R-PBGA-B8
JESD-609 Code
e3
e1
Length
1.35 mm
1.57 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Moisture Sensitivity Level
1
1
Number of Bits
1
1
Number of Functions
2
2
Number of Ports
2
2
Number of Terminals
8
8
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSON
VFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Propagation Delay (tpd)
24 ns
4.6 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.35 mm
0.5 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
0.8 V
0.8 V
Supply Voltage-Nom (Vsup)
1.1 V
1.1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Tin (Sn)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
NO LEAD
BALL
Terminal Pitch
0.35 mm
0.4 mm
Terminal Position
DUAL
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
1 mm
0.77 mm
Base Number Matches
2
1
Pbfree Code
ECCN Code
EAR99
Samacsys Manufacturer
Texas Instruments
Control Type
ENABLE LOW
Count Direction
UNIDIRECTIONAL
Load Capacitance (CL)
30 pF
Max I(ol)
0.004 A
Package Equivalence Code
BGA8,2X4,16
Packing Method
TR
Power Supply Current-Max (ICC)
0.0009 mA
Prop. Delay@Nom-Sup
31.1 ns
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