74AUP2G157GM vs 74AUP1G158GF feature comparison

74AUP2G157GM Nexperia

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74AUP1G158GF NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Package Description VQCCN, 1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, SON-6
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code S-PQCC-N8 S-PDSO-N6
JESD-609 Code e4 e3
Length 1.6 mm 1 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 8 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VQCCN VSON
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 22.8 ns 21 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Tin (Sn)
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.35 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.6 mm 1 mm
Base Number Matches 2 2
Pbfree Code Yes
Part Package Code SON
Pin Count 6
Load Capacitance (CL) 30 pF
Max I(ol) 0.0017 A
Package Equivalence Code SOLCC6,.04,14
Packing Method TR
Prop. Delay@Nom-Sup 21 ns

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