74AUP1G158GF vs 74AUP2G157DC feature comparison

74AUP1G158GF NXP Semiconductors

Buy Now Datasheet

74AUP2G157DC Nexperia

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code SON
Package Description 1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, SON-6 VSSOP,
Pin Count 6
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code S-PDSO-N6 R-PDSO-G8
JESD-609 Code e3 e4
Length 1 mm 2.3 mm
Load Capacitance (CL) 30 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.0017 A
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 6 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON VSSOP
Package Equivalence Code SOLCC6,.04,14
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 21 ns
Propagation Delay (tpd) 21 ns 22.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) NICKEL PALLADIUM GOLD
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.35 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1 mm 2 mm
Base Number Matches 2 2

Compare 74AUP1G158GF with alternatives

Compare 74AUP2G157DC with alternatives