74AUP2G125GM vs 74AUP2G126DC feature comparison

74AUP2G125GM NXP Semiconductors

Buy Now Datasheet

74AUP2G126DC Nexperia

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code QFN
Package Description VBCC, LCC8,.06SQ,20 VSSOP,
Pin Count 8
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Control Type ENABLE LOW
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code S-PBCC-B8 R-PDSO-G8
JESD-609 Code e4 e4
Length 1.6 mm 2.3 mm
Load Capacitance (CL) 30 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.0017 A
Moisture Sensitivity Level 1 1
Number of Bits 1 1
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VBCC VSSOP
Package Equivalence Code LCC8,.06SQ,20 TSSOP8,.12,20
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 24 ns
Propagation Delay (tpd) 24 ns 24 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal Form BUTT GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.6 mm 2 mm
Base Number Matches 3 2

Compare 74AUP2G125GM with alternatives

Compare 74AUP2G126DC with alternatives