74AUP1G80GW
vs
SN74AUC1G79YZPR
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
TEXAS INSTRUMENTS INC
Part Package Code
TSSOT
BGA
Package Description
1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5
GREEN, DSBGA-5
Pin Count
5
5
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
AUP/ULP/V
AUC
JESD-30 Code
R-PDSO-G5
R-XBGA-B5
JESD-609 Code
e3
e1
Length
2.05 mm
1.4 mm
Load Capacitance (CL)
30 pF
15 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max I(ol)
0.0017 A
0.005 A
Moisture Sensitivity Level
1
1
Number of Bits
1
1
Number of Functions
1
1
Number of Terminals
5
5
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
INVERTED
TRUE
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
TSSOP
VFBGA
Package Equivalence Code
TSSOP5/6,.08
BGA5,2X3,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
27.2 ns
3.9 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
0.5 mm
Supply Voltage-Max (Vsup)
3.6 V
2.7 V
Supply Voltage-Min (Vsup)
0.8 V
0.8 V
Supply Voltage-Nom (Vsup)
1.1 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Tin (Sn)
TIN SILVER COPPER
Terminal Form
GULL WING
BALL
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
DUAL
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
1.25 mm
0.9 mm
fmax-Min
510 MHz
275 MHz
Base Number Matches
3
1
Max Frequency@Nom-Sup
200000000 Hz
Output Characteristics
3-STATE
Prop. Delay@Nom-Sup
3.9 ns
Compare 74AUP1G80GW with alternatives
Compare SN74AUC1G79YZPR with alternatives