Findchips: Compare 74AUP1G34GW vs 74AUP1G34GW-Q100,125

74AUP1G34GW vs 74AUP1G34GW-Q100,125 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes
Part Life Cycle Code	Active	Transferred
Ihs Manufacturer	NEXPERIA	NXP SEMICONDUCTORS
Package Description	TSSOP,	TSSOP,
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	AUP/ULP/V	AUP/ULP/V
JESD-30 Code	R-PDSO-G5	R-PDSO-G5
JESD-609 Code	e3
Length	2.05 mm	2.05 mm
Logic IC Type	BUFFER	BUFFER
Moisture Sensitivity Level	1
Number of Functions	1	1
Number of Inputs	1	1
Number of Terminals	5	5
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)	260
Propagation Delay (tpd)	20.8 ns	20.8 ns
Qualification Status	Not Qualified
Seated Height-Max	1.1 mm	1.1 mm
Supply Voltage-Max (Vsup)	3.6 V	3.6 V
Supply Voltage-Min (Vsup)	0.8 V	0.8 V
Supply Voltage-Nom (Vsup)	1.1 V	1.1 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	TIN
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30
Width	1.25 mm	1.25 mm
Base Number Matches	3	2
Screening Level		AEC-Q100
	Logic » Gates	Logic » Gates