74AUP1G14GF
vs
NC7WZ04L6X
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FAIRCHILD SEMICONDUCTOR CORP
Part Package Code
SON
MICROPAK MLP
Package Description
VSON, SOLCC6,.04,14
1 MM, ROHS COMPLIANT, MO-252UAAD, MICROPAK-6
Pin Count
6
6
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
AUP/ULP/V
LVC/LCX/Z
JESD-30 Code
S-PDSO-N6
R-PDSO-N6
JESD-609 Code
e3
e4
Length
1 mm
1.45 mm
Load Capacitance (CL)
30 pF
50 pF
Logic IC Type
INVERTER
INVERTER
Max I(ol)
0.0017 A
0.024 A
Moisture Sensitivity Level
1
1
Number of Functions
1
2
Number of Inputs
1
1
Number of Terminals
6
6
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSON
VSON
Package Equivalence Code
SOLCC6,.04,14
SOLCC6,.04,20
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE
SMALL OUTLINE, VERY THIN PROFILE
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
20 ns
Propagation Delay (tpd)
20 ns
11 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
YES
NO
Seated Height-Max
0.5 mm
0.55 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
0.8 V
1.65 V
Supply Voltage-Nom (Vsup)
1.1 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Tin (Sn)
NICKEL PALLADIUM GOLD
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.35 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
1 mm
1 mm
Base Number Matches
2
1
Manufacturer Package Code
6LD, MICROPAK, JEDEC MO-252, 1.0MM WIDE - MLP (PREMOLDED)
ECCN Code
EAR99
Compare 74AUP1G14GF with alternatives
Compare NC7WZ04L6X with alternatives