74AUP1G09GW
vs
74AUP1G08GF,132
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
TSSOT
SON
Package Description
TSSOP, TSSOP5/6,.08
1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, SON-6
Pin Count
5
6
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
AUP/ULP/V
AUP/ULP/V
JESD-30 Code
R-PDSO-G5
R-PDSO-N6
JESD-609 Code
e3
e3
Length
2.05 mm
1 mm
Load Capacitance (CL)
30 pF
30 pF
Logic IC Type
AND GATE
AND GATE
Max I(ol)
0.0017 A
0.0017 A
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Inputs
2
2
Number of Terminals
5
6
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
OPEN-DRAIN
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
VSON
Package Equivalence Code
TSSOP5/6,.08
SOLCC6,.04,14
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, VERY THIN PROFILE
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
24 ns
24 ns
Propagation Delay (tpd)
24 ns
24 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
YES
NO
Seated Height-Max
1.1 mm
0.5 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
0.8 V
0.8 V
Supply Voltage-Nom (Vsup)
1.1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin (Sn)
Tin (Sn)
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
0.35 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
1.25 mm
1 mm
Base Number Matches
2
2
Manufacturer Package Code
SOT891
Factory Lead Time
4 Weeks
Compare 74AUP1G08GF,132 with alternatives
74AUP1G08GF,132 vs 74AUP1G08GF/S500,132
74AUP1G08GF,132 vs 74AUP1G08GS,132
74AUP1G08GF,132 vs 74AUP1G08GF/S500
74AUP1G08GF,132 vs 935292833132
74AUP1G08GF,132 vs 74AUP1G08GF
74AUP1G08GF,132 vs 74AUP1G08GM,132
74AUP1G08GF,132 vs 74AUP1G08GM