74AUP1G08GF,132 vs 74AUP1G08GF feature comparison

74AUP1G08GF,132 NXP Semiconductors

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74AUP1G08GF Nexperia

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code SON
Package Description 1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, SON-6
Pin Count 6
Manufacturer Package Code SOT891
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-N6 S-PDSO-N6
JESD-609 Code e3 e3
Length 1 mm 1 mm
Load Capacitance (CL) 30 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.0017 A
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON VSON
Package Equivalence Code SOLCC6,.04,14
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 24 ns
Propagation Delay (tpd) 24 ns 24 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 0.5 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) TIN
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.35 mm 0.35 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1 mm 1 mm
Base Number Matches 2 3
Supply Voltage-Nom (Vsup) 1.1 V

Compare 74AUP1G08GF,132 with alternatives

Compare 74AUP1G08GF with alternatives