74AHC1G32GW,115 vs TC7SH32F(TE85L,F) feature comparison

74AHC1G32GW,115 NXP Semiconductors

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TC7SH32F(TE85L,F) Toshiba America Electronic Components

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code TSSOP SSOP
Package Description PLASTIC, MO-203, SOT353-1, SC-88A, 5 PIN 0.95 MM PITCH, PLASTIC, SSOP-5
Pin Count 5 5
Manufacturer Package Code SOT353-1
Reach Compliance Code unknown unknown
Family AHC/VHC/H/U/V LV/LV-A/LVX/H
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3
Length 2.05 mm 2.9 mm
Logic IC Type OR GATE OR GATE
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP LSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Propagation Delay (tpd) 14.5 ns 13 ns
Seated Height-Max 1.1 mm 1.4 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.95 mm
Terminal Position DUAL DUAL
Width 1.25 mm 1.6 mm
Base Number Matches 2 1
Rohs Code Yes
HTS Code 8542.39.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare 74AHC1G32GW,115 with alternatives

Compare TC7SH32F(TE85L,F) with alternatives