74AHC1G126GV-Q100 vs 74AHC1G126GW,165 feature comparison

74AHC1G126GV-Q100 Nexperia

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74AHC1G126GW,165 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Package Description TSSOP, TSSOP, TSSOP5/6,.08
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family AHC/VHC/H/U/V AHC/VHC/H/U/V
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3 e3
Length 2.9 mm 2 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1 1
Number of Bits 1 1
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 14.5 ns 14.5 ns
Screening Level AEC-Q100
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.95 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.5 mm 1.25 mm
Base Number Matches 2 2
Part Package Code TSSOP
Pin Count 5
Manufacturer Package Code SOT353-1
Control Type ENABLE HIGH
Load Capacitance (CL) 50 pF
Max I(ol) 0.008 A
Output Characteristics 3-STATE
Package Equivalence Code TSSOP5/6,.08
Packing Method TR
Prop. Delay@Nom-Sup 9.5 ns
Qualification Status Not Qualified

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Compare 74AHC1G126GW,165 with alternatives