74AHC1G125GF vs 74AHC1G126GW,165 feature comparison

74AHC1G125GF NXP Semiconductors

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74AHC1G126GW,165 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SON TSSOP
Package Description 1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, SON-6 TSSOP, TSSOP5/6,.08
Pin Count 6 5
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family AHC/VHC/H/U/V AHC/VHC/H/U/V
JESD-30 Code S-PDSO-N6 R-PDSO-G5
JESD-609 Code e3 e3
Length 1 mm 2 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1 1
Number of Bits 1 1
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 6 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON TSSOP
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 14.5 ns 14.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.35 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 1 mm 1.25 mm
Base Number Matches 2 2
Manufacturer Package Code SOT353-1
Control Type ENABLE HIGH
Load Capacitance (CL) 50 pF
Max I(ol) 0.008 A
Output Characteristics 3-STATE
Package Equivalence Code TSSOP5/6,.08
Packing Method TR
Prop. Delay@Nom-Sup 9.5 ns

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