74AHC1G08GW,165 vs NC7S08M5X feature comparison

74AHC1G08GW,165 NXP Semiconductors

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NC7S08M5X National Semiconductor Corporation

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Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NATIONAL SEMICONDUCTOR CORP
Part Package Code TSSOP
Package Description TSSOP, THERMALLY ENHANCED, PLASTIC, SOT-23, 5 PIN
Pin Count 5
Manufacturer Package Code SOT353-1
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3
Length 2.05 mm 2.9 mm
Logic IC Type AND GATE AND GATE
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 16 ns 25 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.95 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 1.25 mm 1.6 mm
Base Number Matches 1 1
Load Capacitance (CL) 50 pF
Package Equivalence Code TSOP5/6,.11,37

Compare 74AHC1G08GW,165 with alternatives

Compare NC7S08M5X with alternatives