74AHC1G08GV/C,125 vs MC74VHC1G09DTT1 feature comparison

74AHC1G08GV/C,125 NXP Semiconductors

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MC74VHC1G09DTT1 onsemi

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Part Life Cycle Code Obsolete Obsolete
parentfamilyid 4093826
Ihs Manufacturer NXP SEMICONDUCTORS ONSEMI
Part Package Code TSOP TSOP
Package Description PLASTIC, SC-74A, SOT-753, 5 PIN SC-59, SOT-23, TSOP-5
Pin Count 5 5
Manufacturer Package Code SOT753
Reach Compliance Code unknown not_compliant
Family HC/UH AHC/VHC
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3 e0
Length 2.9 mm 3 mm
Logic IC Type AND GATE AND GATE
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 16 ns 16.5 ns
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish TIN TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.95 mm 0.95 mm
Terminal Position DUAL DUAL
Width 1.5 mm 1.5 mm
Base Number Matches 1 2
Rohs Code No
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Load Capacitance (CL) 50 pF
Max I(ol) 0.008 A
Moisture Sensitivity Level 1
Output Characteristics OPEN-DRAIN
Package Equivalence Code TSOP5/6,.11,37
Packing Method TR
Peak Reflow Temperature (Cel) 235
Prop. Delay@Nom-Sup 11 ns
Qualification Status Not Qualified
Schmitt Trigger NO

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Compare MC74VHC1G09DTT1 with alternatives