74AHC157BQ,115 vs 935265467118 feature comparison

74AHC157BQ,115 NXP Semiconductors

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935265467118 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code QFN SOIC
Package Description 2.50 X 3.50 MM, 0.85 MM HEIGHT, MO-241, SOT763-1, DHVQFN-16 3.90 MM, PLASTIC, MS-012, SOT-109-1, SO-16
Pin Count 16 16
Manufacturer Package Code SOT763-1
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family AHC/VHC/H/U/V AHC
JESD-30 Code R-PQCC-N16 R-PDSO-G16
JESD-609 Code e4 e4
Length 3.5 mm 9.9 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Propagation Delay (tpd) 21.5 ns 16 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 2.5 mm 3.9 mm
Base Number Matches 2 2
Pbfree Code Yes
Output Characteristics 3-STATE

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